通过正交试验对比分析了镀液pH值,主盐、还原剂以及络合剂浓度等因素对铝基表面化学镀镍-磷镀层磷含量及镀速的影响.结果表明:镀液pH值的影响最主要,其次为主盐和还原剂浓度;对于选定成分的酸性(3.5≤pH≤6)镀液,随pH值的增大,镀层磷原子分数由22.5%(pH=3.5)逐渐减至12.6%(pH=6.0),而镀速随pH值的增大而增加,达到最大值21.0 μm·h-1(pH=5.0)后变化不大;镀层磷含量随主盐NiSO4浓度增大而降低,随还原剂NaH2PO2浓度增大而增加,而主盐和还原剂浓度的增大都可增加镀速;最终获得了磷原子分数为15.2%、镀速达到21.0 μm·h-1的镀层.
所属栏目
试验研究“十一五”国家科技支撑计划资助项目(2006BAE03B02-2)
收稿日期
2009/5/232009/11/23
作者单位
柏冬梅:大连理工大学材料科学与工程学院, 大连 116085
黄明亮:大连理工大学材料科学与工程学院, 大连 116085
备注
柏冬梅(1982-),女,辽宁沈阳人,硕士研究生.
引用该论文:
BAI Dong-mei,HUANG Ming-liang.Effects of pH Value and Concentration of Solution on P Content and Deposition Rate during Electroless Ni-P Plating on Aluminum Substrate Surface[J].Materials for mechancial engineering,2010,34(6):28～32
柏冬梅,黄明亮.镀液pH值及浓度对铝基表面化学镀镍-磷镀层磷含量及镀速的影响[J].机械工程材料,2010,34(6):28～32
参考文献
【1】
ALAM M O,CHAN Y C,TU K N.Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn-Ag solder and Au/electroless Ni(P)/Cu bond pad[J].J Appl Phys,2003,94(6):4108-4115.
【2】
YOON J W,LEE C B,JUNG S B.Growth of an intermetallic compound layer with Sn-3.5Ag-5Bi on Cu and Ni-P/Cu during aging treatment[J].J Electron Mater,2003,32(11):1195-1202.
【3】
AHMED SHARIF,CHAN Y C.Investigation of interfacial reactions between Sn-Zn solder with electrolytic Ni and electroless Ni (P) metallization[J].Journal of Alloys and Compounds,2007,440:117-121.
【4】
QI G,CHEN X,SHAO Z.Influence of bath chemistry on zincate morphology on aluminum bond pad[J].Thin Solid Films,2002,406:204-209.
【5】
ALAM M O,CHAN Y C,HUNG K C.Reliability study of the electroless Ni-P layer against solder alloy[J].Microelectron Reliab,2002,42(7):1065-1073.
【6】
SOHN Y C,YU J,KANG S K,et al.Study of spalling behavior of intermetallic compounds during the reaction between electroless Ni-P metallization and lead-free solders[J].J Mater Res,2004,19(8):2428-2436.
【7】
KUMAR A,CHEN Z.Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint[J].Materials Science and Engineering A,2006,423:175-179.
【8】
LIN Y C,DUH J G.Phase transformation of the phosphorus-rich layer in SnAgCu/Ni-P solder joints[J].Scripta Materialia,2006,54:1661-1665.
【9】
YOON J W,JUNG S B.Growth kinetics of Ni3Sn4 and Ni3P layer between Sn-3.5Ag solder and electroless Ni-P substrate[J].Journal of Alloy and Compounds,2004,376:105-110.
【10】
MAYER J W,LAU S S.Electronic materials science:for integrated circuits in Si and GaAs[M].New York:MacMillan,1990.
【11】
杨海燕,朱万学.非晶化学镀镍工艺研究与应用[J].腐蚀与防护,2004,25(3):121-123.
【12】
万家瑰,李淑华,冯小军.铝基化学镀Ni-P合金工艺研究[J].电镀与精饰,2007,29(5):42-44.
【13】
李宁.化学镀实用技术[M].北京:化学工业出版社,2004.
【14】
李学伟,赵国刚.Ni-P化学镀高稳定性镀液及优化规律[J].黑龙江科技学院学报,2004,14(11):236-239.
【15】
蔡晓兰,黄鑫,贺子凯.化学镀镍磷合金镀速的研究[J].电镀与涂饰,2001,20(12):39-41.
【16】
关凯书,梁安波,吕宝君,等.磷含量对镍磷化学镀层结构及表面形貌的影响[J].机械工程材料,2000,24(2):20-22.
