共晶80Au-20Sn钎料在大功率电子及光电子器件封装中作为密封和芯片焊接材料特别具有吸引力,在这些应用中焊点的可靠性对于满足设备长期稳定运行至关重要.简要回顾了钎料焊点可靠性提出的背景,介绍了焊点可靠性的评价方法及当前不同工艺对80Au-20Sn钎料焊点的影响;指出今后其可靠性研究重点主要集中在复杂服役条件下焊接工艺优化、焊点可靠性测试方法、焊点寿命预测模型以及焊点本构模型等方面.
所属栏目
综述国家自然科学基金资助项目(50575160);教育部高等学校博士点基金资助项目(20050056035)
收稿日期
2008/10/292009/5/26
作者单位
张国尚:天津大学材料科学与工程学院, 天津 300072
荆洪阳:天津大学材料科学与工程学院, 天津 300072
徐连勇:天津大学材料科学与工程学院, 天津 300072
韩永典:天津大学材料科学与工程学院, 天津 300072
备注
张国尚(1977-),男,河北滦南人,工程师,博士研究生.
引用该论文:
ZHANG Guo-shang,JING Hong-yang,XU Lian-yong,HAN Yong-dian.Research Status and Prospect for 80Au-20Sn Solder Joint Reliability[J].Materials for mechancial engineering,2009,33(11):1～4
张国尚,荆洪阳,徐连勇,韩永典.80Au-20Sn钎料焊点可靠性研究现状与展望[J].机械工程材料,2009,33(11):1～4
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