在63Sn-37Pb钎料合金单轴时相关变形和失效行为研究的基础上,提出了耦合损伤时相关循环本构模型和疲劳失效模型;在模型中,引入了损伤演化方程,考虑了时相关效应;应用该理论模型对该钎料在不同应变率、不同应变幅值、不同保持时间及其历史下的变形行为及疲劳失效行为进行了模拟,并对疲劳寿命进行了预测.结果表明:该理论模型是合理有效的.
所属栏目
物理模拟与数值模拟教育部博士点基金资助项目(20040613002);国家自然科学基金资助项目(10372086)
收稿日期
2007/11/22008/3/15
作者单位
罗艳:西南交通大学应用力学与工程系, 四川 成都 610031
高庆:西南交通大学应用力学与工程系, 四川 成都 610031
杨显杰:西南交通大学应用力学与工程系, 四川 成都 610031
备注
罗艳(1980-),女,四川射洪人,博士研究生.
引用该论文:
LUO Yan,GAO Qing,YANG Xian-jie.Damage-coupled Time-dependent Theoretical Model for 63Sn-37Pb Solder Alloy[J].Materials for mechancial engineering,2008,32(11):78~81
罗艳,高庆,杨显杰.63Sn-37Pb钎料合金耦合损伤时相关理论模型[J].机械工程材料,2008,32(11):78~81
被引情况:
【1】
郭洪强, "63Sn-37Pb和Sn-3Ag-0.5Cu合金钎料的扭转低周疲劳性能",机械工程材料
38, 65-69(2014)
参考文献
【1】
Oleg D Sherby,Eric M Taleff.Influence of grain size,solute atoms and second-phase particles on creep behavior of polycrystalline solids[J].Materials Sciences and Engineering A,2002,322:89-99.
【2】
Ren W,Qian Z,Lu M,et al.Investigation of a new lead free solder alloy using strip specimens[J].ASME:Journal of Electronic Packaging,1999,121:271-274.
【3】
Stephens J J,Frear D R.Time-dependent deformation behavior of near-eutectic 60Sn-40Pb solder[J].Metallurgical and Materials Transactions A,1999,30:1301-1313.
【4】
Shi X Q,Zhou W,Pang H L J,et al.Effect of temperature and strain rate on mechanical properties of 63Sn/37Pb solder alloy[J].ASME:Journal of Electronic Packaging,1999,121:179-185.
【5】
杨显杰,邵贰,罗艳,等.63Sn-37Pb钎料室温单轴循环时的变形行为[J].西南交通大学学报,2005,40(6):774-778.
【6】
Wild R N.Some fatigue properties of solders and solder joints[C]//National Electronic Packaging Conference[s.l]:[s.n],1974:105-117.
【7】
Solomon H D.Creep,strain rate sensitivity and low cycle fatigue of 60/40 solder[J].Brazing Soldering,1986,11:8-75.
【8】
Shi X Q,Pang H L J,Zhou W,et al.Low cycle fatigue analysis of temperature and frequency effects in eutectic solder alloy[J].International Journal of Fatigue,2000,22:217-228.
【9】
Yang X J,Chow C L,Lau K J.A unified viscoplastic description of 63Sn/37Pb solder alloy under cyclic straining and stressing[J].J Mechanical Engineering Science,2004,218:1-12.
【10】
Skipor A F,Harren S V,Botisis J.On the constitutive response of 63/37 Sn/Pb eutectic solder[J].ASME:Journal of Engineering Materials Technology,1996,118:1-11.
【11】
Yang X J,Chow C L,Lau K J.Time-dependent cyclic deformation and failure description of 63Sn/37Pb solder alloy[J].International Journal of Fatigue,2003,25(6):533-546.
【12】
Yang Xianjie,Nassar Sayed.Constitutive modeling of time-dependent cyclic straining for solder alloy 63Sn-37Pb[J].Mechanics of Materials,2005,37:801-814.
【13】
Shi X Q,Pang H L J,Zhou W,et al.A modified energy-based low cycle fatigue model for eutectic solder alloy[J].Scripta Materialia,1999,41(3):289-296.
【14】
Qian Z,Ren W,Liu S.A damage coupling framework of unified viscoplasticity for the fatigue of solder alloys[J].ASME:Journal of Electronic Packaging,1999,121:162-168.
【15】
Armstrong P J,Frederick C O.A mathematical representation of the multiaxial Bauschinger effect[R].[s.l.]:Central Electricity Generating Board,1966.
【16】
Yang X J.Constitutive description of temperature-dependent nonproportional cyclic viscoplasticity[J].ASME J Eng Mater Tech,1997,119:12-19.
【17】
李灏.损伤力学基础[M].济南:山东科学技术出版社,1992.